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    <title>Shrinking Violence Blog</title>
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    <updated>2010-03-15T16:25:31Z</updated>
    
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<entry>
    <title>Party like it&apos;s 1999</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/03/semiconductor-profitability-2009.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.566</id>

    <published>2010-03-15T16:25:27Z</published>
    <updated>2010-03-15T16:25:31Z</updated>

    <summary>Industry analyst firm iSuppli has run the numbers on companies in the semiconductor business and found they are running with levels of operating profitability not seen since the glory days of the Internet boom. Overall operating profitability rose to 21.4...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Economics" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Supply &amp; Demand" scheme="http://www.sixapart.com/ns/types#category" />
    
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        <![CDATA[<p>Industry analyst firm iSuppli has run the numbers on companies in the semiconductor business and found they are running with levels of operating profitability not seen since the glory days of the Internet boom. </p>

<p><a href="http://www.isuppli.com/News/Pages/Semiconductor-Industry-at-Most-Profitable-Level-in-a-Decade.aspx">Overall operating profitability rose to 21.4 per cent</a> according to iSuppli in the fourth quarter of 2009, the highest level since the last quarter of 2000. Those working around the industry then will remember those heady days, which were quickly followed by a sudden post-Christmas hangover when purchasing managers staggered into their warehouses and wondered: &#8220;Cripes. Did we really order all this stuff?&#8221;</p>

<p>For those thinking that the world was only just beginning to move out of recession late last year, a lot of the recovery in profitability in chipmaking has come from very aggressive supply management, also known as not spending anything on stuff to make chips with. Major customers are now in the unusual position of not being able to name their price and it&#8217;s not going to get any easier for them any time soon even though the big chipmakers are now opening up their wallets to expand production capacity.</p>

<p>Even during the disastrous first quarter of 2009, prices did not fall as far as they used to &#8212; because the chipmakers did not allow inventory to build up in the way it did in 1995 or 2000.</p>

<p>President and CEO of iSuppli Derek Lidow also cited the increasing focus of chipmakers: &#8220;The semiconductor industry has almost completely eschewed the broad-line model that once was the hallmark of the largest players in the business. Instead, chipmakers now are concentrating on specific market segments, allowing them to focus on areas where they have pricing power and a competitive advantage. This has allowed them to improve profit margins and to cut overhead.&#8221;</p>

<p>That position echoes former Infineon president Wolfgang Ziebart at Electronica in 2006: &#8220;Before, size was very important. This is over.&#8221;</p>

<p>At the same panel session, Professor Hermann Simon of Simon-Kucher and Partners went a bit further by chiding the chip industry for being &#8220;stupid&#8221; by chasing market share.</p>

<p>Infineon&#8217;s board thanked Ziebart for his insight by firing him and then wound up shutting down Qimonda just months ahead of a pricing recovery that might have helped the German memory maker find a buyer as a going concern rather than a source of cheap production tools for Texas Instruments.</p>
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    </content>
</entry>

<entry>
    <title>Foundry mix</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/03/foundry-fab-process-mix-2009.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.564</id>

    <published>2010-03-14T17:51:05Z</published>
    <updated>2010-03-14T18:04:39Z</updated>

    <summary>This is the last time a graph like this will appear for a while. Because Chartered Semiconductor Manufacturing is now part of Globalfoundries there won&#8217;t be an opportunity to get information on the processes the company is running from financial...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Fabless" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Supply &amp; Demand" scheme="http://www.sixapart.com/ns/types#category" />
    
    <category term="chartered" label="Chartered" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="fab" label="fab" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="foundry" label="foundry" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="globalfoundries" label="Globalfoundries" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="process" label="process" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="smic" label="SMIC" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="tsmc" label="TSMC" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="umc" label="UMC" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="waferrevenue" label="wafer revenue" scheme="http://www.sixapart.com/ns/types#tag" />
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    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p><img src="http://blog.shrinkingviolence.com/images/foundrymix.jpg" alt="foundrymix.jpg" border="0" width="450" height="404" align="left" />This is the last time a graph like this will appear for a while. Because Chartered Semiconductor Manufacturing is now part of Globalfoundries there won&#8217;t be an opportunity to get information on the processes the company is running from financial reports. AMD will only report profit or loss in its figures now that the company has switched to equity accounting even though AMD holds the lion&#8217;s share of the key stock class <a href="http://phx.corporate-ir.net/External.File?item=UGFyZW50SUQ9MzY2MzY3fENoaWxkSUQ9MzYxMjk4fFR5cGU9MQ==&amp;t=1">that determines overall ownership</a>.</p>

<p>Now that the results are in for 2009, it&#8217;s possible to see what effect the semiconductor industry&#8217;s bungee recession (thanks to Future Horizons&#8217; Malcolm Penn for the inspiration for the phrase) has had on the shift towards more advanced processes. What&#8217;s interesting about the first set of charts is that you&#8217;d hardly know the foundries practically turned their machines off for a couple of quarters.</p>

<p>Utilisation plunged to 30 per cent in the dark days of early 2009 before bouncing back to near capacity by the middle of the year. Had it not been for TSMC&#8217;s 40nm yield problems, the transition towards 40/45nm processes might have been a bit quicker. But the severity of the recession arguably gave the number-one foundry a bit of breathing space, arguably helped by the better yield on more expensive flip-chip packages that the 40G-process chips would typically go into.</p>
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        <![CDATA[<p>Chartered&#8217;s small spike in 45nm orders at the start of 2009 is not just a fluke of the graph, coming at a time when revenues had plummeted. Perhaps helped by delays at TSMC, the Singapore foundry saw about $8m worth of 45nm orders go out the door in the first quarter. These then fell back towards the autumn. </p>

<p><img src="http://blog.shrinkingviolence.com/images/foundryrevs.jpg" alt="foundryrevs.jpg" border="0" width="450" height="334" align="left" />It&#8217;s not clear what happened in the last quarter &#8212; Chartered did not report 4Q09 figures because it had come under the wing of Globalfoundries by the end of December &#8212; but the trend for 45nm was in the wrong direction ahead of that. However, 65nm production was still growing reasonably well and still exceeded that of larger company UMC as recently as 3Q09.</p>

<p>Although UMC has been able to ramp 65nm production quickly in the past few quarters, it&#8217;s possible that the number-two foundry did not catch Chartered by the end of the year. But it&#8217;s now hard to tell and the focus at Globalfoundries will be on developing post-65nm processes.</p>

<p>In the second set of graphs, you can see how foundries have been affected revenue-wise by the late-2008/early-2009 recession. However, despite the economic and the yield problems at TSMC, it seems that 45nm-class processes are more or less tracking the ramp of 65nm two years earlier. At this scale, to match the other graphs, it&#8217;s more or less impossible to see the Chartered contribution to 45nm. It is in there but hard to see without a little <a href="http://blog.shrinkingviolence.com/images/45nm-2009.png">magnification</a>.</p>

<p>The question will be how big the foundries&#8217; slice of the 45nm pie will grow. So far, each process has topped out in the $1.2bn range even if you aggregate the results from the big four. </p>

<p><img src="http://blog.shrinkingviolence.com/images/idmshare.jpg" alt="IDM share of foundry revenue" border="0" width="250" height="214" align="left" />In the past year, foundry sales were knocked badly by the decision by integrated device manufacturers (IDMs) to pull back from using external fabs. Their share is rising again but this is a volatile set of customers for the foundries as they have a greater range of choices fabless companies do not. As more IDMs go fab-lite, clearly they too run out of choice. But this is a market that often rewards the biggest players. To even play in some markets, chipmakers have to be able to sell hundreds of millions of dollars&#8217; worth of product to be considered contenders. And if you are that big, owning your own fab is still an option.</p>

<p>It seems reasonable to assume that the peak revenue from 40nm will get much closer to $1.5bn, and possibly surpass it. But with the market on a two-year process-upgrade treadmill and high-k, metal-gate versions of 32nm offering some performance advantages &#8212; at a cost &#8212; there is still the risk that the companies who bet on 65nm will wait for 32nm and 28nm to roll along before making the jump. If companies play this waiting game, it will slightly favour Globalfoundries &#8212; all other things being equal &#8212; as it tries to build up capacity to service a wider range of customers. But for those who do pick 45nm-generation processes for the next year or two, TSMC has built up a similar early volume lead to the one it had with 65nm.</p>
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    </content>
</entry>

<entry>
    <title>MEMS makes the trip into a CMOS fab</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/03/Baolab-MEMS-CMOS-process.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.562</id>

    <published>2010-03-08T17:46:12Z</published>
    <updated>2010-03-08T18:06:38Z</updated>

    <summary>Micromachined chips promise much, which is why every time they turn up in a new system &#8212; such as the Nunchuk controller in the Nintendo Wii or the motion sensor in the iPhone &#8212; it&#8217;s tempting to herald a new...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Fabless" scheme="http://www.sixapart.com/ns/types#category" />
    
    <category term="cmos" label="CMOS" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="etch" label="etch" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="mems" label="MEMS" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="mobilephone" label="mobile phone" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="motionsensor" label="motion sensor" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="rfswitch" label="RF switch" scheme="http://www.sixapart.com/ns/types#tag" />
    
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        <![CDATA[<p><img src="http://blog.shrinkingviolence.com/images/baolab-metal-mesh.jpg" alt="baolab-metal-mesh.jpg" border="0" width="450" height="293" align="left" />Micromachined chips promise much, which is why every time they turn up in a new system &#8212; such as the Nunchuk controller in the Nintendo Wii or the motion sensor in the iPhone &#8212; it&#8217;s tempting to herald a new dawn for MEMS. It&#8217;s invariably a case of &#8220;this time it&#8217;s all going to happen for MEMS&#8221;.</p>

<p>But some big problems still face MEMS. It&#8217;s not as cheap to make as you&#8217;d expect and the one thing you&#8217;d expect manufacturers would have down to a fine art &#8212; integration with other microelectronics &#8212; is still not easy to do. It&#8217;s even hard to package the things. They often need to be carefully sealed using special caps to stop moisture disrupting their delicate inner workings. </p>

<p>The seven-strong team at Barcelona-based startup <a href="http://www.baolab.com/">Baolab</a> reckon they have an answer to at least some of these problems. Having already developed a novel type of MEMS structure &#8212; basically a floating bar in an electrostatic box &#8212; several years ago, the company was faced with the problem of making it commercially viable.</p>
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        <![CDATA[<p>Dave Doyle, CEO at Baolab, explained that CTO Josep Montoya founded the company in 2003. &#8220;He was working on this idea of contactless switching. He established some contacts with some of the big guys who came in and said that the cost had to come down a long way.</p>

<p>&#8220;There has been talk in the MEMS world of whether it is possible to build MEMS in CMOS. But what&#8217;s new is that someone has figured out how to do the work. It came out of necessity,&#8221; said Doyle.</p>

<p>&#8220;It is 100 per cent compatible with CMOS. That is really the point. A lot of people talk about MEMS and CMOS in the same breath. Normally they mean MEMS on top of CMOS.&#8221;</p>

<p>In this case, the MEMS elements are made out of the same metal wires as those used to connect transistors on a CMOS chip. &#8220;As far as I know, Baolab is the only company to figure it out,&#8221; said Doyle.</p>

<p><img src="http://blog.shrinkingviolence.com//images/dave-doyle-baolab.jpg" alt="Dave Doyle, Baolab CEO" title="Dave Doyle, Baolab CEO" border="0" width="190" height="285" align="left" />As some of the patents covering the process have only been filed recently and have not been published, Doyle didn&#8217;t talk in detail about the process. But he said both the MEMS design and the processing are important to making this work on a conventional CMOS process. &#8220;It is 80 per cent design and 20 per cent process,&#8221; Doyle claimed.</p>

<p>&#8220;This is bringing together three disciplines which is what has held people back. You have to have a deep understanding of the chemistry that goes on during etch. You have got to understand the CMOS process and how to design devices for MEMS knowing that CMOS was never meant to be used in this way.&#8221;</p>

<p>And Doyle stressed that the manufacturing up to the point where etching with hydrofluoric acid releases the moving elements is conventional CMOS processing. The box that contains the MEMS elements is defined using features and shapes that help control the extent of the acid-vapour etch, which can be difficult to control. </p>

<p>&#8220;Hydrofluoric acid needs water as a catalyst but once it starts it turns into a self-catalying process that runs away in a second if you are not careful. We developed a way to control that or, more importantly, to stop it,&#8221; said Doyle. &#8220;Without that control, you can end up with unpredictable cavity size from one wafer to another. We can&#8217;t have that.&#8221;</p>

<p>To form the cavity, the chip goes all the way through the fab to the point where it has the final passivation layer deposited on top. The one extra bit of the Baolab process then takes over, opening up holes over the box that contains the MEMS element and etching away the intermetal dielectric. Once that step is complete, the holes are filled and the device sent for packaging.</p>

<p>The release step can be performed at the wafer fab or the packaging house. However, Doyle said it&#8217;s likely that the wafer fab will take care of this because packaging houses do not like working with hydrofluoric acid. Who does? (Although a lecturer from university did pour neat HF on his hand as his party piece. As with chips, it doesn&#8217;t start eating away until enough water is present to kick-start the reaction. Eventually, enough water is drawn from the skin to start the process. But you&#8217;ve got a minute or so to leave it there before you have to worry about it.)</p>

<p>Baolab claims, once the holes in the top have been filled in, the chip can use regular epoxy packaging &#8212; not the specialised caps that a lot of MEMS devices needs, which helps drive the cost down further. &#8220;We use standard deposition equipment to close off the holes,&#8221; said Doyle.</p>

<p>The original MEMS device patented by Montoya was a relay switch. This remains one of the key products for Baolab, although there is a strong chance the first one will be a motion sensor. Whichever product comes first, it will be aimed at mobile phones. 
The company is planning on having engineering samples ready by the end of the year having made test devices on a 0.18&micro;m process running on an 8in wafer line. </p>

<p>The RF switch needs close contact with electrodes, which demands clean contacts which are achievable but the motion sensor does not have that requirement, reducing the technological risk. &#8220;Plus, sensors is an established market,&#8221; said Doyle. &#8220;If we can take a slice of that market because the device is cheaper, you don&#8217;t need a lot of market share to generate a lot of cash.</p>

<p>&#8220;Because the technology is applicable to a wide range of markets and applications, we have to pick our fights. The greatest volume is in mobile handsets. But there are other consumer products where the technology could be applied,&#8221; said Doyle.</p>

<p>Although Baolab will sell its own products first, licensing to other companies is an option for the future. The current generation of technology works with aluminium metallisation as that is prevalent on 0.18&micro;m-class processes. However, because the release step focuses on the dielectric rather than the metal, copper is an option for the future using post-0.13&micro;m technologies. </p>

<p>&#8220;Our whole drive has been about bringing down the cost as far as can be physically achieved. The jury is out on copper as to which  &#8212; 0.13&micro;m, 90nm or another &#8212; will be the most cost-efficient process. But we are working toward copper. There are some interesting attractions to using copper, especially on the RF side,&#8221; Doyle explained.</p>
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    </content>
</entry>

<entry>
    <title>Who moved my socket?</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/03/nvidia-ion2-missing-socket.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.561</id>

    <published>2010-03-02T20:13:08Z</published>
    <updated>2010-03-02T20:32:41Z</updated>

    <summary>A column in PC World on the launch of nVidia&#8217;s Next-Generation Ion (or Ion2 as a lot of people call it) decries the way that the graphics processor (GPU) company has backed away from Ion being a &#8216;platform&#8217; into just...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Design" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Fabless" scheme="http://www.sixapart.com/ns/types#category" />
    
    <category term="atom" label="Atom" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="chipset" label="chipset" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="gpu" label="GPU" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="ion2" label="Ion2" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="nextgenerationion" label="Next-Generation Ion" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="nvidia" label="nVidia" scheme="http://www.sixapart.com/ns/types#tag" />
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p>A column in PC World on the launch of nVidia&#8217;s Next-Generation Ion (or Ion2 as a lot of people call it) decries the way that the graphics processor (GPU) company <a href="http://www.pcworld.com/article/190409/nvidia_unveils_nextgeneration_ion_platform.html">has backed away from Ion being a &#8216;platform&#8217;</a> into just being an additional chip for Intel&#8217;s own Atom chipset. There isn&#8217;t a whole lot that nVidia can do about that. Welcome to the land of disappearing sockets.</p>

<p>While people speculate on why <a href="http://bits.blogs.nytimes.com/2010/02/24/a-tie-up-between-intel-and-tsmc-fizzles/">Intel and TSMC have so far failed to get anyone into production</a> with an Atom system-on-chip (SoC), the one company with a real reason for licensing the processor core finds its latest creation dangling off the end of a PCI Express bus provided by Intel&#8217;s Pine Trail chipset.</p>

<p>When Intel launched the first generation of Atom, it was a tiny sliver of silicon that relied entirely on other chips to control a PC. Although you pretty much had to buy the Atom with its support chips from Intel, nVidia encouraged PC makers to dispense with the standard chipset and replace it with the Ion and its built-in graphics.</p>

<p>With Pine Trail, Intel decided to move its own GPU and main memory controller into the Atom processor itself and sell a smaller peripheral controller &#8216;South Bridge&#8217; device, leaving nVidia with far less scope to have an influence on what an Atom-based PC would look like inside.</p>
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        <![CDATA[<p><img src="http://blog.shrinkingviolence.com//images/david-ragones-ion.jpg" alt="david-ragones-ion.jpg" border="0" width="190" height="260" align="left" />&ldquo;This is really driven by what Intel is doing in their underlying architecture,&rdquo; said David Ragones, director of marketing for nVidia. </p>

<p>However, nVidia thinks there is still scope for having a second GPU in the system, although the company has come up with a slightly bizarre way of touting its power efficiency.</p>

<p>Ragones said: &ldquo;We have a very different perspective on the market to our competition. Intel, when they talk about them, regard netbooks as being very basic devices. Our perspective is that when we pair a GPU with a CPU it becomes a better experience.&rdquo;</p>

<p>With previous generations of device, if two GPUs were present in a PC, the user had to switch from integrated graphics to the second GPU manually before running a 3D or video-intensive program. The Ion GPU can switch on and off automatically based on which applications are running. It either detects certain graphics calls or using settings in a control panel to activate the Ion when a certain program, such as a game, fires up.</p>

<p>But, here&#8217;s the weird bit: nVidia&#8217;s argument is that it&#8217;s power efficiency is as good as the Pine Trail. You get a full 10 hours of battery life with the Next-Generation Ion. Just as long as it&#8217;s not actually switched on and doing stuff. I can see what nVidia is trying to get at with this but it&#8217;s a bit like handing Intel the ball, pointing to the goal and then leaping out of the way. Maybe watching your motherboard sockets disappear before your eyes courtesy of silicon scaling does that to a company.</p>

<p>If it is switched on, nVidia&#8217;s argument is that an Atom-based system can run programs that the basic Pine Trail cannot touch. Ragones claimed that, using the Ion GPU, an Atom-based netbook or small PC could run games and video-intensive applications such as Muvee. &ldquo;Intel will tell you that you need a higher-performance CPU to run these applications. You would get a black screen with Muvee using just Pine Trail,&rdquo; Ragones claimed.</p>

<p>Because it doesn&#8217;t have any of chipset functions inside, although it does have its own memory controller, and is made on a 40nm process rather than a 65nm process the Ion2 works out about 40 per cent the size of its predecessor.</p>

<p>There are two versions of the Next-Generation Ion device. One has eight processor cores, which has roughly the same performance as the previous generation. The other has 16 cores, which Ragones said offers a 50 per cent improvement in performance versus the previous generation.</p>
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    </content>
</entry>

<entry>
    <title>Tabula trades space for time</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/03/Tabula-FPGA-architecture-launch.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.560</id>

    <published>2010-03-01T08:06:48Z</published>
    <updated>2010-03-01T20:24:45Z</updated>

    <summary>I think the only sane advice I could give anyone on whether to start up a programmable-logic company today is: &#8220;I wouldn&#8217;t start from here if I were you.&#8221; Perhaps the best response is to come up with what is,...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Design" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Fabless" scheme="http://www.sixapart.com/ns/types#category" />
    
    <category term="chipdesign" label="chip design" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="fpga" label="FPGA" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="ic" label="IC" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="iram" label="IRAM" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="reconfigurablecomputing" label="reconfigurable computing" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="tabula" label="Tabula" scheme="http://www.sixapart.com/ns/types#tag" />
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p><img src="http://blog.shrinkingviolence.com//images/steve-teig-dieplots.jpg" alt="Steve Teig pictured in front of several Tabula die-plots" border="0" width="190" height="285" align="left" />I think the only sane advice I could give anyone on whether to start up a programmable-logic company today is: &#8220;I wouldn&#8217;t start from here if I were you.&#8221;</p>

<p>Perhaps the best response is to come up with what is, at first glance, the most insane architecture I&#8217;ve ever seen. Even its creator concedes that your best bet is not to think to what&#8217;s going inside because it gets too hard to conceptualise. Even the tools that build the design on <a href="http://www.tabula.com/">Tabula&#8217;s</a> architecture don&#8217;t deal directly with what happens inside the device.</p>

<p>Tabula is president and CTO Steve Teig&#8217;s fifth startup. Two were in electronic design automation (EDA) &#8212; the most recent being Simplex Solutions, which sold to Cadence Design Systems &#8212; and two in biotechnology. Even he spent a while, after leaving Cadence in 2003, wondering whether starting an FPGA company was a wise move considering the trail of dead companies that has formed in the wake of Xilinx&#8217; and Altera&#8217;s dominance of the market since the early 1990s.</p>

<p>The company&#8217;s CEO, Dennis Segers, was responsible for the Virtex architecture at Xilinx &#8212; the company&#8217;s top-selling family of FPGAs &#8212; and was the man venture capitalists hauled in whenever they had a potential investment in an FPGA startup to make. And those VCs have not been short of choice in the past decade. Neither have they done very well out of it. Segers didn&#8217;t rate any of them.</p>
]]>
        <![CDATA[<p>However, after grilling Teig for several days in front of a whiteboard, Segers had a Victor Kiam moment and decided to join Tabula as CEO. The startup has a number of people who joined from Xilinx, including the vice president of sales, Steve Haynes, who had retired after leaving the number-one FPGA maker.</p>

<p>Teig contends that most of these companies started from the hardware and bolted on the design support later. Everyone still alive in the FPGA business knows it&#8217;s all about the tools. That&#8217;s how you can get away with selling chips for a thousand dollars a pop for those people who have to use the largest ones available. Teig says he started from a concept for an architecture, worked out whether it was possible to get a tool to support it and then find someone to work out how that hardware would work in practice. The result is, according to him, pieces of silicon that can sell for $200 versus the $1000+ an equivalent device from Xilinx or Altera might cost.</p>

<p>Now, I concede that most of this reads like one of those lifestyle-meets-investment pieces that results from a slick presentation. It&#8217;s actually taken two full meetings to get to this point. I have reservations about the potential success of Tabula just given the recent history of the FPGA business and also because the approach taken by the company is novel &#8212; leading to design issues that can&#8217;t be readily assessed from a discussion about the architecture.</p>

<p>On the other hand, it&#8217;s such an audacious attempt to rethink the way hardware is implemented, you can&#8217;t fail to like it. At first glance, Tabula is simply a reconfigurable computing architecture. Students of the history of this area will realise that startups trying to do this have flamed-out even faster than FPGA startups.</p>

<p><strong>The cost of programmability</strong><br />
The problem with reconfigurable machines up to now is that the cost of changing logic on the fly has been pretty high. It&#8217;s too hard to get the gigabytes of data into a device to sustain any kind of throughput. For example, the architecture put together by Stretch was superficially interesting but hobbled by the speed at which you could shovel data into the device. </p>

<p>What Teig calls the &#8216;spacetime&#8217; architecture is different because the memory used to store the chip&#8217;s state is held so close to the actual logic. It also benefits by the way in which scaling trends have provided some things, such as raw clock speed, in excess without the ability to use that speed fully. And active power continues to creep down, albeit more slowly than before, while static power consumption inexorably moves up. As static power is largely  proportional to the number of idle transistors on a device, having a high ratio of active versus idle transistors is A Good Thing. And being able to get the same amount of logic out of fewer transistors is also A Good Thing.</p>

<p>&#8220;I believe spacetime is fundamental to the speed of computation,&#8221; Teig claims. &#8220;For any technology that you might use to do computation it becomes cheaper to do reconfiguration locally than to send the signal somewhere else for computation. We&#8217;ve been trying to look 25 years ahead with this approach. </p>

<p>&#8220;At a certain point most devices will be spacetime because it will take less energy to reconfigure than to send the signal far away. This is the next wave of computing strategy,&#8221; he adds.</p>

<p>Within the architecture, strips of memory flank the logic elements, which are based around lookup tables, and the multiplexers that route signals between them. This is a subtle difference from a classic FPGA architecture, where a lot of the memory needed to hold state and temporary data is spread across the chip. With the Tabula architecture, much more of the state and data is stored in large blocks of static memory (SRAM).</p>

<p><strong>Use denser memory</strong><br />
Any block of SRAM has a certain overhead associated with it. So, the cost of adding multiple rows is not that high, until you&#8217;ve added a lot. SRAM is the one thing that scales well with Moore&#8217;s Law: chip designers work hard to make sure it&#8217;s as dense as possible because so much of it is on-chip now. And it&#8217;s regular structure means that optimising the core cell pays back millions of times over.</p>

<p>With those additional banks of state memory, Tabula divides a raw clock signal of more than 1GHz into multiple sub-cycles &#8212; Tabula refers to these sub-cycles as folds. Each sub-cycle, the logic elements and muxes read out their state from the local memory, perform the computation and then move onto the next sub-cycle. Signals still in flight at the end of each sub-cycle are caught by transparent latches within the programmable-interconnect section and held until the next sub-cycle that needs those signals as inputs. Any logic behind the latch once it&#8217;s closed can be reused by independent logic on subsequent sub-cycles. </p>

<p><img src="http://blog.shrinkingviolence.com//images/time-via.jpg" alt="time-via.jpg" border="0" width="450" height="496" align="left" />The transparent latch &#8212; a &#8216;time via&#8217; in Tabula-speak &#8212; looks to the hardware description level (HDL) code like a buffer. As just about every chip design tool on the market can insert buffers without having an effect on the HDL code this avoids the need to pipeline the logic to allow long sequences of combinatorial logic to be &#8216;folded&#8217; onto a constantly reconfiguring collection of logic elements. Which is why Tabula calls the sub-cycles folds.</p>

<p>The reason for using words such as &#8216;fold&#8217; to describe what&#8217;s going on is to make life easier for the design engineer using the devices and, indeed, for the people at Tabula who have written the tools.</p>

<p>Teig himself concedes that trying to think of the architecture as constantly reconfiguring is very difficult to deal with. It&#8217;s much easier to think of the folds as teh way to a virtual 3D chip. Each fold is a layer of logic connected by the time vias. So, in the initial parts, made on a 40nm process at TSMC, provide eight layers of logic using just one physical surface.</p>

<p>Why does this make the life of the tools writers easier? Because a 3D place-and-route algorithm is not conceptually different from a conventional 2D system. You can use the similar cost functions to those used in place-and-route tools that deal with an entirely physical set of logic elements and wires. A time via that connects fold one with fold eight has a longer &#8216;length&#8217; than one that joins two adjacent folds, and it blocks more of the virtual interconnect. So, optimisation tools can attempt to minimise that cost to get better overall chip utilisation.</p>

<p>As Teig explains, it gets much easier to conceptualise once you&#8217;ve disposed of the idea that the architecture is time-slicing: &#8220;For 99 per cent of my work I pretend the chip is 3D: it&rsquo;s much easier to visualise the x, y and z axes rather than trying to visualise what comes into existence when, which just give you a headache.&#8221;</p>

<p>Teig reckons the two advantages that Tabula has over reconfigurable-computing predecessors, such as Chameleon and Quicksilver, which disappeared more or less without trace, are two-fold: &#8220;We can reconfigure thousands of times faster than anyone who preceded us. The second part is that we have chosen to hide the revolution.&#8221; </p>

<p>However, the picture is slightly complicated by the fact that you don&#8217;t have to use all eight folds. If you want portions of the chip to run faster than an effective 200MHz, you just reduce the number of folds and have them run at 400MHz, 800MHz or, in the extreme case on the initial crop of 40nm devices, 1.6GHz. </p>

<p>&#8220;Why eight folds?&#8221; Teig asks rhetorically. &#8220;It&rsquo;s a marketing reason rather than technical. We figured out that most logic is running at 200MHz or less. Even on ASICs that run at 500MHz, often only a small part needs to run at 500MHz. We wanted to make sure that for the 200MHz case there we could do the full folding. And we worked out it wasn&rsquo;t worth the hassle of trying to go faster than 1.6GHz on a 40nm process.&#8221; </p>

<p><strong>More folds</strong><br />
According to Tabula, the density advantage over a conventional FPGA, assuming eight folds, is around three times. A conventional FPGA is roughly 10 to 20 times less space efficient custom chip, such as an application-specific integrated circuit (ASIC) depending on how much memory your design needs. This makes the current generation of Tabula&#8217;s  devices around four to eight times less dense than an ASIC.</p>

<p>By taking advantage of faster transistors in future processes, Teig reckons Tabula can attain parity in terms of density with ASICs and application-specific standard products (ASSPs) within three process generations &#8212; at the current rate of development, that is just after the middle of the decade.</p>

<p>&#8220;We are trying to take ASIC as well as ASSP market share.
We are positioning ourselves not to be the number-six FPGA company but to be a major player in semiconductors,&#8221; Teig says.</p>

<p>This is far from the first time that someone in the FPGA business has said their product will take share away from the ASIC and ASSP markets. Rising design costs point to fewer design starts for custom chips. And yet in the past decade, sales of FPGA have barely moved at all. The revenue for the entire FPGA business has hovered around $3.5bn since the middle of the decade despite total semiconductor sales creeping closer to $300bn a year.</p>

<p>The trends surely point towards programmability. But that does not necessarily equate to FPGA. What&#8217;s happened is that standard products have gradually eaten into the custom-chip business simply because it often works out cheaper to buy a device that ships in high volume and not use half of it than to design a device that just has what you need on it. </p>

<p>FPGAs tend to do well in communications infrastructure equipment because there are not many off-the-shelf parts that can do the job. In consumer and other high-volume markets the chances are a platform processor does more or less what you need.</p>

<p><strong>Cost trends</strong><br />
Teig argues that the spacetime approach will scale down into more consumer-oriented markets. But the company is concentrating first on the communications business as it is the key market for FPGAs. It also means that, assuming it can get two to three times more logic on each square millimetre of silicon, the company gains maximum benefit from the yield curve. As chip size approaches the reticle limit, yield plummets. Tabula, on the other hand, is not trying to ship chips close to that limit. So, the price advantage that Tabula can claim to have reaches its maximum against Altera&#8217;s and Xilinx&#8217;s most expensive devices.</p>

<p>The question is: will it work?</p>

<p>I haven&#8217;t spent this long trying to get to grips with an architecture for many years. Part of that is due to the affable Teig who is in the unusual position of being both president and CTO. That has neatly avoided the usual problem of trying to get past the marketing veep&#8217;s understanding of the system to try to work out what is going on beneath the buzzwords.</p>

<p>The approach that Tabula has taken seems to fit well with the major trends in silicon and, potentially, could benefit by what happens once 2D scaling in silicon runs out of steam towards the end of the decade. Relying on the scaling ability of large blocks of memory rather than random logic or interconnect looks sensible. Memory has the best chance to profit from a move into the third dimension and there is a strong commercial impetus to keep scaling memory.</p>

<p>There are some conceptual similarities between what Tabula is doing and the research by David Patterson at the University of California at Berkeley on IRAM &#8212; devices that are primarily memories with processors bolted on the side.</p>

<p>Hardware architecture only gets you so far. FPGA companies live or die on the strength of tool support. Teig&#8217;s background in EDA is a clear benefit here. Until we&#8217;ve seen how real customers have dealt with the tools, it&#8217;s tough to say how well Tabula will do here. But the claim by the company is that porting to Tabula is no more tricky than porting to Altera or Xilinx. There is no demand on the customers to wrap their heads around reconfigurable computing. As Altera and Xilinx are pushing reconfiguration more heavily for their forthcoming 28nm architectures &#8212; and this will involve a mental shift for designers &#8212; this stands Tabula in good stead. </p>

<p>Then there is the reaction one has when faced with a new FPGA architecture. I know my immediate response was: &#8220;That&#8217;s never going to work&#8221; effect. Not only is this an FPGA architecture attempting to take on two powerful incumbents, it is an architecture trying to do with dynamic reconfiguration, which compounds the &#8220;that&#8217;s never going to work&#8221; effect.</p>

<p>Of all the new FPGA architectures that have appeared in the past 15 years, Tabula looks to be the strongest candidate. I have reservations as to whether it can genuinely break the FPGA market&#8217;s glass ceiling but it stands a better chance of doing it than what is currently out there on the market.</p>
]]>
    </content>
</entry>

<entry>
    <title>Fujitsu&apos;s I/O ring cycle</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/03/fujitsu-tsmc-28nm-scaling.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.559</id>

    <published>2010-03-01T08:02:25Z</published>
    <updated>2010-03-01T08:02:31Z</updated>

    <summary>At the TSMC 2010 Executive Forum, Yoji Hino from Fujitsu talked about the company&apos;s move to a fab-lite operation with the shift to 28nm. Although the Japanese company has its own fabs able to turn out 40nm devices, it will...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
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        <category term="Economics" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Fabless" scheme="http://www.sixapart.com/ns/types#category" />
    
    <category term="28nm" label="28nm" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="40nm" label="40nm" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="fujitsu" label="Fujitsu" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="io" label="I/O" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="padpitch" label="pad pitch" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="scaling" label="scaling" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="sram" label="SRAM" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="tsmc" label="TSMC" scheme="http://www.sixapart.com/ns/types#tag" />
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p>At the TSMC 2010 Executive Forum, Yoji Hino from Fujitsu talked about the company's move to a fab-lite operation with the shift to 28nm. Although the Japanese company has its own fabs able to turn out 40nm devices, it will use TSMC for 28nm production.</p>

<p>One issue that Hino covered was the impact that the I/O ring has on device scaling from 40nm to 28nm. Unless you stuff the device full of transistors the I/O ring on wirebond devices can quickly dominate the cost because the pads don't scale anywhere near as fast as SRAM cells and logic gates. Analogue also generally doesn't benefit that much from scaling, except in terms of switching speed.</p>

<p>Hino presented a chart that showed good scaling from 65nm to 40nm for a device with 20 million gates of logic and 15Mbit of SRAM plus some analogue. On a 65nm process, this measures 10.1mm on a side. On a 40nm process, the dimensions reduce to 7.3mm on a side, a reduction of 48 per cent. However, the increasing dominance of the I/O ring and the analogue means that the 28nm device sees a slightly smaller reduction in area: 41 per cent for a chip that is 5.6mm on a side.</p>

<p>To stop the I/O ring from being too much of a burden, Fujitsu and Toshiba are cutting the pad pitch from 25&micro;m to 22.5&micro;m for staggered pins. The single-row pitch will drop from 40&micro;m to 35&micro;m. As smaller devices on 40nm could benefit from a reduction in I/O pitch, the older process will, apparently, also have the smaller staggered-pin dimensions from the end of the year, when 28nm is supposed to go live. The single-row pitch on 40nm will remain unchanged, presumably on the assumption that if a device is only using a single row of pins around the edge, it's hardly going to be pad-limited.</p>]]>
        
    </content>
</entry>

<entry>
    <title>TSMC on 40nm and 28nm yield issues</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/02/TSMC-40nm-28nm-yield.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.558</id>

    <published>2010-02-28T17:44:12Z</published>
    <updated>2010-03-01T09:36:12Z</updated>

    <summary><![CDATA[At the company&#8217;s executive forum held in Yokohama, Japan, TSMC&#8217;s senior vice president of R&amp;D, Shang-yi Chiang, provided some background on why yield problems surfaced on the 40nm process &#8212; and also some indications that 28nm will not exactly be...]]></summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Design" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Fabless" scheme="http://www.sixapart.com/ns/types#category" />
    
    <category term="28nm" label="28nm" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="40nm" label="40nm" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="altera" label="Altera" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="arm" label="ARM" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="designrules" label="design rules" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="highkmetalgate" label="high-k metal gate" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="hkmg" label="HKMG" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="nvidia" label="nVidia" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="tsmc" label="TSMC" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="xilinx" label="Xilinx" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="yield" label="yield" scheme="http://www.sixapart.com/ns/types#tag" />
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p><img src="http://blog.shrinkingviolence.com//images/shang-yi-chiang.jpg" alt="shang-yi-chiang.jpg" border="0" width="190" height="243" align="left" />At the company&#8217;s executive forum held in Yokohama, Japan, TSMC&#8217;s senior vice president of R&amp;D, Shang-yi Chiang, provided some background on why yield problems surfaced on the 40nm process &#8212; and also some indications that 28nm will not exactly be plain sailing.</p>

<p>Chiang pointed to the shift to immersion lithography &#8212; a choice that Intel delayed by a generation &#8212; and the use of a new low-k dielectric in the metal layers as the main culprits for the foundry&#8217;s problems. He claimed that defect density has reduced significantly since the middle of last year, when chairman Morris Chang decided to expand the team working on 40nm at TSMC.</p>

<p>Chiang said the move from 90nm to 65nm was comparatively simple and the relative cost quite low. &#8220;Moving to 45 and 40nm is a lot more challenging,&#8221; he said. &#8220;This is the first time we began to use 193nm immersion [lithography]. This means the photoresist during exposure is submerged in water and [presents] a very high potential defect [density].&#8221;</p>

<p>The low-k dielectric, with a dielectric constant 2.5, was also more fragile than its predecessor. It seems that 40nm was a partial rerun of the 130nm introduction when chipmakers discovered that soft dielectrics and packaging machinery are not the best of mates &#8212; the pressure needed to seal the package crushed the metal interconnect. </p>
]]>
        <![CDATA[<p>As Altera fared much better than nVidia in getting yielding silicon from 40nm, it suggests that the biggest problem lay in wirebond packages. High-end FPGAs tend to use flip-chip packaging. It&#8217;s more expensive to use, which is why you don&#8217;t want to use it if possible on high-volume devices, but the controlled collapse the process uses presumably develops a lot less stress than the punch from a gold wirebonder.</p>

<p>An FPGA also has greater opportunities for redundancy in the interconnect, although not too much as these devices are interconnect-limited. Chiang pointed to graphics processors in particular as challenging as they have a couple of billion vias on them. &#8220;You can imagine the degree of challenge when you try to make every one of these two billion vias functional,&#8221; said Chiang.</p>

<p>In practice, however, companies such as nVidia do implement redundant vias where possible as the disappearing via problem has been with the industry since the introduction of 130nm.</p>

<p>Chiang added: &#8220;So, moving to 40nm, that&#8217;s why it&#8217;s getting pretty challenging, pretty difficult to do. And going forward to 28nm, the biggest difficulty by far  is the high-k metal gate. It&#8217;s really [going to introduce] a lot of material issues.&#8221;</p>

<p>Chiang said the company is &#8220;only four months away from mass production of 28LP&#8221;, which is the version of 28nm that uses a conventional polysilicon gate. This process is mainly for low-speed, high-density devices, such as baseband and application processors in mobile phones. He said the yield on 64Mbit SRAM test chips around 65 per cent. &#8220;This is a quite comfortable number at this stage of the technology and we don&#8217;t see much [of a] problem at this moment.&#8221;</p>

<p>The bigger change comes towards the end of the year, at least, with the introduction of the higher-speed metal-gate process. &#8220;We are not as ready as 28LP. For example, the yield is only 26 per cent, instead of 65 per cent, but we have three more months to go. Actually, we have five months from now and I believe we can catch up with the yield. And 28HPL will be introduced at the end of this year. At this time, we achieve a 15 per cent yield for 64Mbit,&#8221; Chiang claimed.</p>

<p>&#8220;For all those three versions we are feeling quite comfortable compared to our past experience at this stage of the development,&#8221; he added.</p>

<p>Like Intel, TSMC has found that the traditional laggard in the transistor-speed stakes, the p-channel device, is coming out faster than expected. This is partly because it&#8217;s currently relatively easy to apply strain to the p-channel using buried layers of silicon germanium. </p>

<p>Chiang said the performance of the n-channel transistors on 28nm is, right now, about 5 per cent behind the target that was determined by modelling in SPICE. &#8220;For the PMOS, we are about 5 per cent better than target at the moment,&#8221; he said.</p>

<p>Because of the issues with the reliability of very low-k dielectrics, Chiang said the company is shifting attention from trying to reduce capacitance in the metal interconnect &#8212; which is determined partly by the dielectric constant of the insulator &#8212; to improving resistance of the metal lines themselves. It&#8217;s not entirely clear from Chiang&#8217;s presentation whether this is an across-the-board move or simply the use of wider metal lines for high-speed circuits.</p>

<p><img src="http://blog.shrinkingviolence.com//images/nojogsplease.jpg" alt="nojogsplease.jpg" border="0" width="450" height="108" /></p>

<p>Also like Intel, TSMC is making the design rules for 28nm more restrictive. These will help reduce variability. Having the polysilicon used to form the gate run in just one direction, it&#8217;s possible to make the edge of the gate smoother. The company will also disallow the jogs, short gates and T-shapes often used in dense standard cells to save space (as shown in the diagram above). Line-edge roughness is now a major contributor to variability. Chiang said C/D control is easier with polysilicon running in just one direction. It&#8217;s something that Intel used to great effect in its recent processor designs. </p>

<p>Chiang claimed the introduction of restricted design rules has nothing to do with the decision, like Intel and in contrast to the Common Platform group, to adopt a gate-last approach to making a high-k metal gate. </p>

<p>&#8220;There are misunderstandings that TSMC introduced RDR mainly because of the gate-last [structure]. I&#8217;d like to share with you the reason we use RDR had little to do with the choice of gate-last. The [reason] is more for the performance and for the control which will result in [better] yield and cost.&#8221; </p>

<p>There is a penalty to introducing this kind of restriction: gate density plummets. Chiang said a 70 per cent linear shrink generally leads to a two-fold improvement in areal density from process generation to generation. Factor in the restricted design rules, and the areal improvement is just 1.6x. &#8220;So there&#8217;s a 40 per cent layout penalty and that&#8217;s very, very significant. However, this can be recovered if we adopt a different layout style, and it&#8217;s not difficult to do,&#8221; Chiang claimed.</p>

<p>It&#8217;s not clear what this style looks like and how it affects standard-cell design in particular. But Chiang added: &#8220;TSMC has demonstrated that it will be very willing to share with our customers on how we did that and I&#8217;m sure there is more than one way to do that.&#8221;</p>

<p>A question is whether TSMC will share that information equally with independent library developers. ARM has been keen to stress how close its relationship is to IBM and the Common Platform partners with its 32nm and 28nm library development programme. There is little doubt that TSMC will share information with the likes of Altera and nVidia. Will that also go for ARM&#8217;s Artisan group or, indeed, AMD and Xilinx which have stronger links with the Common Platform group of foundries?</p>
]]>
    </content>
</entry>

<entry>
    <title>IPL and the Virtuoso arm-lock</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/02/IPL-design-kit-release.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.557</id>

    <published>2010-02-26T08:58:32Z</published>
    <updated>2010-02-26T09:01:54Z</updated>

    <summary>If you had something like an 80 per cent market share and one of the factors in that was a proprietary language, would you open up the language knowing that this would help competitors turn a foothold into a stronger...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
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    <category term="virtuoso" label="Virtuoso" scheme="http://www.sixapart.com/ns/types#tag" />
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p>If you had something like an 80 per cent market share and one of the factors in that was a proprietary language, would you open up the language knowing that this would help competitors turn a foothold into a stronger position? No, I probably wouldn&#8217;t either. </p>

<p>But there comes a point where the proprietary language becomes a problem to the customers because it makes it harder to use stuff that has been developed outside that environment. And the customers have to choose between migrating or sticking with what they know and reinventing stuff that they know exists elsewhere. If those customers migrate, then the dominant company loses the reason for holding on to that language - it becomes more of a millstone than an advantage.</p>

<p>In the case of custom and analogue design, the language in question is <a href="http://www.cadence.com">Cadence Design Systems</a>&#8217; Skill. It&#8217;s grown like topsy over the years to the point that even people who&#8217;ve worked at Cadence aren&#8217;t quite sure what&#8217;s in it. Those outside the company don&#8217;t stand a chance. But a scripting language like Skill is crucial not only to general custom layout, as it prevents analogue engineers from quietly going mad repeatedly drawing the same shapes over and over again. It also forms the basis of things like process design kits (PDKs) that the foundries provide, as it allows them to define how cells and components are laid out.</p>
]]>
        <![CDATA[<p>If you only support Virtuoso as a foundry, then the work isn&#8217;t too bad. But life suddenly gets more complex if you want to support some of the other custom layout environments, such as SpringSoft&#8217;s Laker or Synopsys&#8217; own foray into layout editing, which can only go so far in being a Virtuoso workalike.</p>

<p>So, the <a href="http://www.prnewswire.com/news-releases/ipl-alliance-announces-first-open-standard-for-interoperable-process-design-kits-85193272.html">initial release</a> of the <a href="http://www.iplnow.com/">Interoperable PDK Libraries (IPL) Alliance</a> standard <a href="http://kn.theiet.org/news/feb10/ipl-pdk.cfm">helps everyone who isn&#8217;t Cadence</a> - it provides a format that foundries such as TSMC can get behind to ensure that they can work with tool suites that don&#8217;t come from Cadence. Tom Quan, deputy director of design methodology at TSMC said the standard will help cut the cost of PDK development at the foundry.</p>

<p>Both Virtuoso and the IPL standards are designed to work with the OpenAccess database format developed by Cadence and now maintained as an open standard by the Silicon Integration Initiative (SI2). The alliance&rsquo;s plan is to donate IPL to SI2, said Oz Levia, vice president of marketing and business development at SpringSoft, one of the members of the IPL Alliance. But things like iPDK can go further than simply scratching the collective itch of people who want to eat into Cadence&#8217;s market.</p>

<p>&ldquo;Custom design gets easier as more standards participate in the game,&rdquo; said Levia.</p>

<p>If it was only the foundries and EDA companies with an interest in iPDK, then Cadence could rest easy. Instead of Skill, although IPL could support that if Cadence opened it up and provided a language reference manual, IPL supports a variety of scripting languages for automation. The main one in use is Python. This makes the scripts far more portable across tools than is the case with Skill code. Companies using the PDKs can more easily build their own routines on top and expect them to work in different tools.</p>

<p>&ldquo;I hope that this will open up a competitive market for more players to innovate and offer their technology. I think it will grow because there will be more automation. Before this, you had to get around the proprietary lock on the Skill code,&rdquo; Levia added, referring to the language used by Virtuoso to automate aspects of layout creation, such as drawing inductors and other on-chip components.</p>

<p>Levia claimed a number of medium-sized integrated device manufacturers and large fabless companies are planning to use IPL, &ldquo;especially the fabless companies that are large enough to have clout with foundries to have custom libraries. They are doing their own PDKs based around IPL&rdquo;.</p>

<p>&ldquo;I think Skill is a huge problem. I know that Cadence is using Skill as a way to force the Cadence customer community to stay with a tool that is less competitive than other tools. I think it&rsquo;s bad in the long run for customers and the industry,&rdquo; said Levia.</p>

<p>&ldquo;I would challenge them to open it up because I think it would be good for customers, the industry and for Cadence. I think it is stifling innovation and it&rsquo;s stifling growth. There is no reason for it.&rdquo;</p>

<p>IPL is not going to affect Cadence&#8217;s position overnight but it threatens to eat into Virtuoso&#8217;s share because some of its most active customers now have a vested interest in not using Skill.</p>
]]>
    </content>
</entry>

<entry>
    <title>Big spenders: top ten fab owners open up their wallets for 2010</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/02/big-spenders-top-ten-fab-owners.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.555</id>

    <published>2010-02-24T21:17:43Z</published>
    <updated>2010-02-24T21:58:09Z</updated>

    <summary>IC Insights has posted its estimates for capital spending by the top ten chipmakers this year as companies open up their wallets in expectation of cashing in on very tight supply through the rest of the year and into 2011....</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Supply &amp; Demand" scheme="http://www.sixapart.com/ns/types#category" />
    
    <category term="capitalexpenditure" label="capital expenditure" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="fab" label="fab" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="foundry" label="foundry" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="intel" label="Intel" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="samsung" label="Samsung" scheme="http://www.sixapart.com/ns/types#tag" />
    <category term="tsmc" label="TSMC" scheme="http://www.sixapart.com/ns/types#tag" />
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p>IC Insights has posted its estimates for <a href="http://www.icinsights.com/news/bulletins/bulletins2010/bulletin20100223.html">capital spending by the top ten chipmakers</a> this year as companies open up their wallets in expectation of cashing in on <a href="http://kn.theiet.org/magazine/issues/1003/analysis-chip-market-1003.cfm">very tight supply through the rest of the year and into 2011</a>.</p>

<p>The analyst firm expects the top ten to increase their spending by 67 per cent in 2010, a bigger jump than that expected for the entire industry. That is also set for a sudden leap in spending, up by 51 per cent, but it&#8217;s an indicator of how the big fab owners are gradually pulling away from the rest of the pack in terms of fab spending. Only the biggest can afford to operator fabs while the rest are forced to rely increasingly on foundry production.</p>

<p>Taiwanese foundry TSMC&#8217;s estimated spend this year is expected to surge by almost 80 per cent, &#8220;spurred on by the challenge from the upstart GlobalFoundries&#8221;, writes IC Insights president Bill McClean. </p>

<p>UMC has increased its own outlay dramatically but is already a long way behind TSMC and won&#8217;t even match GlobalFoundries this year following the incorporation of Chartered Semiconductor Manufacturing into the Abu Dhabi-financed foundry.</p>

<p>TSMC may only be $200m behind Samsung&#8217;s $5bn in terms of 2010 spending. Intel is predicted to pay out around $4.9bn for fab equipment this year and is easily the most conservative spender. However, the company didn&#8217;t cut back heavily last year when everyone else was taking an axe to their capital-expenditure budget. The company has a lot of its 32nm capacity in place ready for the launch of the Westmere generation of processors. And there is no point in contributing to a glut of processors when supplies of everything else will be tight.</p>

<p>The top trio alone &#8212; Intel, Samsung and TSMC &#8212; will account for 38 per cent of all capital spending in the semiconductor business this year. And more than half of the outlay from the top ten, which will represent two-thirds of the total spend. </p>

<p><a href="http://blog.shrinkingviolence.com/images/top-ten-capex-2010-big.jpg"><img src="http://blog.shrinkingviolence.com/images/top-ten-capex-2010.jpg" alt="top-ten-capex-2010.jpg" border="0" width="450" height="304" align="left" /></a></p>

<p>Although these numbers are big, they won&#8217;t have much of an effect on 2010 chip supplies, McClean said at the recent IC Insights seminar in London. Although fab owners are now more efficient at getting tools up and running on the clean-room floor, it still takes several quarters for them to be productive. And the fab-equipment makers have to be able to service the sudden leap in demand having slashed their workforce once again in a sudden semiconductor slump. </p>

<p>However, the big fab owners will have an advantage in ordering: they have cash in the bank. Smaller players, such as the cash-strapped Taiwanese DRAM makers, will probably find themselves at the back of the queue for kit as credit will be in short supply.</p>
]]>
        

    </content>
</entry>

<entry>
    <title>Xilinx takes the TSMC option</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/02/xilinx-takes-the-tsmc-option.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.542</id>

    <published>2010-02-22T22:14:30Z</published>
    <updated>2010-02-23T07:24:02Z</updated>

    <summary>Xilinx will for the first time use the same foundry as its main competitor to make its next generation of programmable logic devices and expects to have parts built on a 28nm process by the end of the year. Xilinx...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Fabless" scheme="http://www.sixapart.com/ns/types#category" />
    
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p>Xilinx will for the first time use the same foundry as its main competitor to make its next generation of programmable logic devices and expects to have parts built on a 28nm process by the end of the year.</p>

<p>Xilinx has nominated Taiwanese foundry TSMC as one of the two suppliers it  plans to use to make field-programmable gate arrays (FPGAs) on the upcoming 28nm process &#8211; which is expected to double density compared to the current 45/40nm-based parts.</p>

<p>Historically, Xilinx has used the world&rsquo;s second largest foundry UMC as its silicon supplier. Although the FPGA maker has turned to a number of foundries since the 130nm generation, including IBM, Samsung and Toshiba, the company has up to now avoided using TSMC. </p>

<p>Chuck Tralka, senior director for product definition at Xilinx, said when the company looked at how it would move on from the 45nm generation, &ldquo;we began a survey of process nodes. Originally, we looked at 32nm and then moving to 28nm.&rdquo;</p>

<p>The company then decided to move straight to 28nm, opting for variants of a high-k, metal-gate process that trade some performance for lower static power consumption, which increases with the number of transistors on a die.</p>

<p>&ldquo;As we looked out at the process vendors. We began with a survey of what we expect to become available from the various foundries. We began looking with an eye to managing the performance issues. We talked to each of the potential foundry partners,&rdquo; said Tralka.</p>

<p>&ldquo;We determined that TSMC and Samsung had the right technology available. We worked with TSMC two years ago and started running test vehicles and began aligning process parameters with internal simulations. We expect to have devices available by the end of the year.</p>

<p>&ldquo;We are working with both partners: one of them is in the lead,&rdquo; said Tralka, but declined to say which foundry is likely to have products ready first.</p>

<p>&ldquo;Both processes are actually fairly similar. They are both high-k, metal-gate and they have similar power/performance characteristics. We work to try to align the processes as much as possible. There are some differences. The families will get tweaked as we prepare to map one for each process or another.&rdquo;</p>

<p>&ldquo;What we will be doing is mapping particular families into particular fabs. And aligning what we think are the best power-performance trade-offs.&rdquo;</p>

<p>Tralka claimed the long-standing relationship between Altera and TSMC &ldquo;is not that big a concern. It is something that we have thought about. But TSMC does a good job working closely with each of their partners without compromising the work of their partners.</p>

<p>&ldquo;Our foundry has been a multi-foundry strategy. We are a larger company company and we need more capacity available to us. And our strategy has been to choose the best partners for each node rather than wedding ourselves to a single process partner,&rdquo; Tralka explained. &ldquo;It&rsquo;s possible that we will make different choices in future generations.&rdquo;<br />
</p>]]>
        
    </content>
</entry>

<entry>
    <title>Infineon goes for the Rodime gambit</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/02/infineon-goes-for-the-rodime-g.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.541</id>

    <published>2010-02-22T13:37:50Z</published>
    <updated>2010-02-22T13:42:20Z</updated>

    <summary>In Dresden and Munich, the receivers in charge of Infineon&apos;s erstwhile memory subsidiary Qimonda are flogging off the remaining fab equipment and office furniture that haven&apos;t found homes at companies such as Texas Instruments. However, Infineon has not sold some...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Supply &amp; Demand" scheme="http://www.sixapart.com/ns/types#category" />
    
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p>In <a href="http://www.qimonda-dresden.de/">Dresden</a> and <a href="http://www.qimonda-muenchen.de/">Munich</a>, the receivers in charge of Infineon's erstwhile memory subsidiary <a href="http://www.qimonda.com/">Qimonda</a> are flogging off the remaining fab equipment and office furniture that haven't found homes at companies such as Texas Instruments.</p>

<p>However, Infineon has not sold some of the soft assets, such as patents that were filed under the German chipmaker's stewardship. And the company seems to be following the <a href="http://en.wikipedia.org/wiki/Rodime">Rodime</a> plan to getting some of its investment back: sue the people still in the DRAM business for infringment. I assume it will stop short of <a href="http://www.qed-ip.com/pr/2001_jul_16.htm">getting into the sports-betting business</a>. However, before it bought Littlewoods' betting operation, Rodime managed to extract a tidy sum in licensing fees from various big disk-drive makers after the Scottish company shut its own manufacturing plant.</p>

<p>Infineon said it filed a complaint with the US International Trade Commission against Elpida, pushing for an exclusion order that will prevent the Japanese memory maker from importing its memory devices into the US even though Infineon no longer sells anything that competes.</p>

<p>So far, the complaint hasn't received a docket number from the ITC, and the organisation has not said that it will investigate the complaint. Infineon has claimed Elpida infringed four of its patents when making the DRAMs it currently ships.</p>

<p>At the IP conference a couple of years ago, Mike McLean of technology-analyst Semiconductor Insights predicted a rise in complaints by companies armed with large patent portfolios. But acknowledged there are issues with suing competitors when the litigation may affect customers of both parties.</p>

<p>&ldquo;The companies may not be the most popular in the world,&rdquo; McLean noted. &ldquo;Are you willing to license [patents] where there are pre-existing business relationships. Do you risk damaging that relationship? Is there a willingness to litigate?&rdquo;</p>

<p>Jack Browne, then president and CEO of MIPS Technologies, put it more starkly: &ldquo;You do have to be prepared for thermonuclear warfare when you decide to go to litigation.&rdquo;</p>

<p>As companies get bounced out of markets in which they used to compete aggressively, more will be tempted to pursue the Rodime option and use the patent collection they built up. As chipmaking involves a complex web of IP, no-one will be immune to the potential of patent suits. And, because those companies have left the market, the threat of mutually assured destruction will not bring the traditional solution: a big bag of cross-licensed patents.</p>]]>
        
    </content>
</entry>

<entry>
    <title>Micron to expand further into flash with Numonyx deal</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/02/micron-to-expand-further-into.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.539</id>

    <published>2010-02-10T09:06:54Z</published>
    <updated>2010-02-10T09:12:01Z</updated>

    <summary>DRAM and flash-memory maker Micron Technology has swooped on Numonyx, the joint venture between Intel, STMicroelectronics and private-equity firm Francisco Partners in a deal worth $1.27bn in what may be a series of acquisitions in the resurgent but cash-strapped memory...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Economics" scheme="http://www.sixapart.com/ns/types#category" />
    
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p>DRAM and flash-memory maker <a href="http://www.micron.com/about/news/pressrelease.aspx?id=7B0431EEEFA2B68E">Micron Technology has swooped on Numonyx</a>, the joint venture between Intel, STMicroelectronics and private-equity firm Francisco Partners in a deal worth $1.27bn in what may be a series of acquisitions in the resurgent but cash-strapped memory business.</p>

<p>Micron will pay using shares &#8211; there is no cash in this deal. "We are not leveraging the balance sheet to do this acquisition," boasted Micron CEO Steve Appleton in a conference call with analysts last night, shortly after all the parties to the deal managed to reach an agreement. Appleton apologised for the lateness of the call but said he wanted to get the news out as quickly as possible. "It is a really solid way to add to the company in a variety of ways."<br />
</p>]]>
        <![CDATA[<p>In terms of size, Numonyx's sales are about three times lower than those of Micron, but the deal will propel Micron into second place in the memory market behind Samsung Semiconductor, narrowly leapfrogging Hynix Semiconductor. It sells into a different market than Micron, although it was one that Micron tried and failed to get into several years ago. The NOR flash business is now much smaller than the bulk NAND flash business that Micron now plays in, alongside DRAM. Appleton said the total market accounts for $4bn versus NAND's $18bn a year. </p>

<p>It's a stable business with fewer players but Appleton argued that scale, or the lack of it, would ultimately compromise the position of companies such as Numonyx and Spansion.</p>

<p>"NOR flash requires investment in development and manufacturing. But, by itself, it doesn't reach the scale you get in NAND and DRAM. It presents the same problem that a lot of [semiconductor] companies face in no-man's land," said Appleton, referring to the mid-sized chipmakers who are faced with the rising cost of process development on sales much smaller than those of the big players. "If you are going to make silicon, you need to make a lot of it. The Numonyx folks might disagree but I think the NOR business was very susceptible to being in that space."</p>

<p>Appleton claimed Numonyx fared better than Spansion in the recent memory slump. "[Spansion] tried to move to advanced processes and it put a lot of stress on the business. It became a cash challenge. Numonyx didn't go down that route. And when Spansion filed for bankruptcy, Numonyx became a beneficiary of that.</p>

<p>"I just don't think you can be a pure NOR player and expect to compete against a Samsung or Micron."</p>

<p>Appleton hinted broadly at possible further consolidation in the memory business, pointing at the DRAM makers of Taiwan that have survived the recession, but only just.</p>

<p>"Where the market is at today, it is obviously on an uptrend. With the lack of investment in the past year and a half, there is not a lot of organic growth to happen. The NOR business has a challenge in the context of what you have to develop. And in the non-NOR business, there are companies that have been significantly weakened, in Taiwan. Their access to capital is limited and they carry a high debt load," said Appleton.</p>

<p>Micron already has business relationships with Nanya: they jointly own Inotera. Because the smaller Taiwanese DRAM makers are cash-strapped, they will find it difficult to invest in new equipment to keep up with Samsung, Micron and Hynix in terms of process and will not be able to take full advantage of the chip market's recovery. This makes them potentially lucrative targets for a less cash-strapped acquirer. </p>

<p>"We will look at these things one at a time," said Appleton.</p>

<p>Although the acquisition will give Micron a solid position in a stable, if not exactly fast-growing memory sector, Appleton mentioned Numonyx's work in phase-change memory several times. </p>

<p>"They have an IP portfolio that we think is pretty strong. They are working on phase-change memory and they have done a great job. As it eats away at the applications that Numonyx is already in, we will be in the best position to take advantage of that," said Appleton.</p>

<p>However, Micron is not expecting phase-change to become a replacement for NAND flash - a claim that phase-change backers often make - at least not in the near term. Micron has dallied with the technology in the past, taking a licence from Energy Conversion Devices, the same company that supplied core phase-change knowhow to Numonyx.</p>

<p>Mark Durcan, president and chief operating officer of Micron, explained the company's thinking: "We see a number of places where phase-change can potentially play. To give a definitive idea of what the strategy will be, we need to wait for the acquisition to close. But there are a lot of opportunities in embedded and in the wireless space.</p>

<p>"We are believers that, eventually, it will play a role in a new tier of memory sitting between DRAM and mass storage. For mass storage, there are opportunities for phase-change, but we are not believers that it will plug in there in the short term.</p>

<p>"There will be successors to NAND. But we are not looking to phase-change as a short-term fix for the NAND business. We are looking at phase-change to create new markets for us as opposed to dealing with existing markets," Durcan concluded.</p>]]>
    </content>
</entry>

<entry>
    <title>Fixed logic to give 28nm FPGAs a helping hand</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2010/02/fixed-logic-to-give-28nm-fpgas.html" />
    <id>tag:blog.shrinkingviolence.com,2010://4.538</id>

    <published>2010-02-02T12:11:45Z</published>
    <updated>2010-02-02T12:11:50Z</updated>

    <summary>The next generation of FPGAs from Altera won&apos;t be quite as programmable as the last - although you will be able to flip some of the logic inside them as they run. For the generation of FPGAs to be made...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Design" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Fabless" scheme="http://www.sixapart.com/ns/types#category" />
    
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p>The next generation of FPGAs from Altera won't be quite as programmable as the last - although you will be able to flip some of the logic inside them as they run. For the generation of FPGAs to be made on a 28nm process, Altera is making several changes.</p>

<p>One change is the merging of HardCopy - the mask-programmed gate array used to provide fixed versions of customer design for less money per die - with the mainstream programmable logic family of Stratix parts. Another is the decision to finally adopt partial reconfiguration so that parts of the logic can be switched in and out while the rest of the system is still running.</p>

<p>"Partial reconfiguration has been around for a long time," said David Greenfield, senior director of Altera's HardCopy business unit. "But this is a fairly significant shift for Altera."<br />
</p>]]>
        <![CDATA[<p>Altera's argument is that it can make partial reconfiguration more tractable for designers through the incremental compilation supported by its Quartus design tool. Essentially, blocks that are to be switched in and out are compiled and then fixed as sub-chips so that when changes are made, any rerouting is carried out inside the chunk of FPGA set aside for them.</p>

<p>The commercial argument for partial reconfiguration, and a number of other changes in the upcoming 28nm family, revolves around the communications business. The idea is not to have the reconfiguration happen many times while the system is running but make it easier to ship one piece of hardware and then configure it for the specific interfaces that the system has to deal with <em>in situ</em>.</p>

<p>The company is staking the future of Stratix on a resurgent communications business. "What is driving the most increased need for processing is video. YouTube last year had more traffic than the entire internet in 2000.</p>

<p>"Our customers are now looking for 400Gb/s systems and a move from 3G wireless to 4G and LTE," Greenfield claimed.</p>

<p>To get an FPGA to cope with 400Gb/s, you need a lot of parallel processing which, according to Greenfield, will drive migration to denser 28nm devices. "You need something in the 320K logic-element range to do 100Gb/s."</p>

<p>A back of the envelope calculation implies a fourfold increase in density needed to get to 400Gb/s with no increase in clock speed. "We can't do it at 40nm. The biggest reticle-busting die we have at 40nm is 530K logic elements."</p>

<p>Even 28nm falls a bit short, not just on density but on power. "We used to get a 20 per cent reduction in core voltage with each generation," said Greenfield. "It will probably drop from 0.9 to 0.8V at 28nm. That reduction isn't going to buy us a lot in terms of active power. Plus you have higher leakage power to contend with."</p>

<p>So, by moving to 400Gb/s transmission, wireline communications vendors would get almost no power reduction, which is not good news when institutions such as Bell Labs are clamouring for energy savings in internet infrastructure equipment.</p>

<p>One answer is to bake into hard logic as much as you can. That is where HardCopy comes in. &ldquo;Embedded HardCopy blocks will be a new way to improve density,&rdquo; said Greenfield.</p>

<p>Although less dense than standard-cell ASIC circuits - by about a factor of two according to Greenfield - the HardCopy gate-array sections are way denser than FPGA and, because they use a fraction of the transistors, use less power. Even for its own hard cores, Altera is beginning to favour HardCopy because it's cheaper to design with.</p>

<p>&ldquo;We have used hard blocks in our architecture for more than ten years, implementing them using standard-cell technology. What we are doing in this generation is using HardCopy functions to get there. It lets us deliver different flavours of the products to customers that fit the needs of their applications.</p>

<p>&ldquo;If there is a way for us to drop the cost of doing product variants, then it allows us to do more and provide more market-specific products,&rdquo; Greenfield added.</p>

<p>FPGAs made using the 28nm will have strips of logic array designed for HardCopy alongside a larger fabric of fully programmable logic. Initially, Altera will use the HardCopy area to do its own market-specific products. &ldquo;But it is envisioned that it will be available for customers to use as well,&rdquo; said Greenfield.</p>

<p>Because of the tenfold difference in density, you won't need a lot of die area set aside for HardCopy to implement a full FPGA's worth of circuitry. And keeping down the area needed for reconfigurability is where the partial reconfiguration comes in.</p>

<p>In terms of schedule, Altera is not saying when the first parts will be available. However, 2011 seems a reasonably safe bet as TSMC is meant to have the process running by the first half of that year. The FPGA maker has already done a lot of prototyping, using the same approach as it did for 40nm - an approach that Greenfield claimed helped the company deal better with yield issues at TSMC than some of the foundry's other customers.</p>

<p>"We have not seen the yield challenges that other early adopters have seen with 40nm," Greenfield insisted. "It hasn't been perfect but it has gone very well in terms of yield. The methodology that we have working with TSMC has served us very well.</p>

<p>"At 28nm, we already have several test chips. We have done four test chips and have a fifth taping out and will probably have a sixth and seventh before taping out a product," said Greenfield.</p>]]>
    </content>
</entry>

<entry>
    <title>Quality street</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2009/12/quality-street.html" />
    <id>tag:blog.shrinkingviolence.com,2009://4.536</id>

    <published>2009-12-14T22:08:53Z</published>
    <updated>2009-12-15T09:43:03Z</updated>

    <summary>About ten years ago, the semiconductor intellectual property (IP) was just getting underway. Although ARM and MIPS had carved out decent businesses for themselves selling processor cores by that time - ARM floated in April 1998 and was riding high...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Design" scheme="http://www.sixapart.com/ns/types#category" />
    
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p>About ten years ago, the semiconductor intellectual property (IP) was just getting underway. Although ARM and MIPS had carved out decent businesses for themselves selling processor cores by that time - ARM floated in April 1998 and was riding high courtesy of the Internet stock boom - there were still serious doubts over the viability of the IP business model. Ten years on, there still are.</p>

<p>At the recent IP-ESC conference in Grenoble, some old favourites from the early days came back with a vengeance, such as the perennial favourite, IP quality. The system-on-chip (SoC) industry has, on the one hand, dealt reasonably well with the quality issue. And IP is now a core part of SoC design. It's hard to think of any SoC on the market that does not incorporate a hardware block bought from somewhere else.  </p>

<p>STMicrolectronics has even formed its own internal IP suppliers. "We separated the SoC team from the IP team," said Francois Remond of ST, primarily to make the IP more robust. A danger with reusing blocks that were never designed for the purpose is that shortcuts taken on the original project don't show until too late on subsequent designs.</p>

<p>"We had recently the experience of transforming an adult RTL block [developed internally] into IP. It has a high cost," said Remond. "It is better to start with reuse in mind."<br />
</p>]]>
        <![CDATA[<p>Remond described how far the IP-based design has come for the company with a set-top box chip designed for a 55nm process. The 209-million transistor chip contains more than 50 IP cores that were supplied as RTL code with a further 160 delivered as hard IP - that is, ready-made layouts for the target process - and close to 500 memory blocks.</p>

<p>In the generations that followed the 2002 design of a smaller chip for a 130nm process, Remond claimed productivity at ST on these projects has increased four-fold. "At the same time, we have reduced the number of bugs inside the IP by a factor of two."</p>

<p>"Debugging IP at the SoC level is very costly. The SoC team does not have a deep understanding of the functionality and the potential problems. If you integrate a piece of IP that doesn't work, you are trapped. Imagine a video circuit with a DDR interface that is not working. You can't continue."</p>

<p>In 1999, other than ARM and some of the other reasonably experienced suppliers, it was hard to tell who had good quality cores and who had a bundle of bugs held by a hardware-description language (HDL) wrapper. Today, it's much easier: there are the people who are still in business and those who aren't. </p>

<p>The difference between the two is frequently down to whether their cores worked or not when inserted into a chip design. The story of the set-top box chip that failed because of one of the IP cores inside it is now a legend in the industry - the supplier pretty soon got out of the IP business.</p>

<p>The quest for quality has made IP a surprisingly expensive business. Joachim Kunkel of Synopsys said the cost of developing, for example, a USB version 3.0 core is anywhere between $5m and $50m. Much of that is spent on making sure it works - often using extensive simulation to check as many possible situations as possible. And manual checking.</p>

<p>"Design reviews continue to be one of the best ways of achieving quality," said Kunkel. "Going through the code line by line, it's amazing what you find."</p>

<p>"The IP vendors who are still in business are all about the rigorousness of the process," said Kathryn Kranen, president of verification tools supplier Jasper Design Automation.</p>

<p>Even with the attention to detail that the surviving IP vendors need, there is still a quality issue. </p>

<p>"We need to move to the next level, which is integration," said Kunkel.</p>

<p>Quality is not so much about whether the core works but whether it works in a target system. A core might work to the letter of the spec but fail within the context of a full chip where it's not possible to implement the spec as written. </p>

<p>"One of the things that we are hearing from customers is that the typical thinking used to be 'I am going to verify to the legal input spec'," said Kranen. But that's not enough. "Even for internal block development there is great value in verifying with very much looser constraints. So that you can harden your block against changes in logic around it or other vendors' IP."</p>

<p>Kranen's suggestion, which is not unusual for a supplier of formal verification, is to use assertions and formal techniques to check whether a bad transaction can confuse an IP block, or whether it will sail through with nothing more than an error signal.</p>

<p>According to Kranen, formal verification has even been used as a support tool. She cited a situation where a customer asked ARM about an apparently aberrant logic trace they found when simulating the core inside their proposed system. ARM support asked for the sequence of events that led up to the odd output trace but the customer wanted to keep that confidential - ARM may call its customers 'partners' but the trust that the word implies isn't often there. So, the ARM engineers used the Jasper tool to work out if the core could get into that state and what it would take to get there.</p>

<p>"It's a tool that provides answers to specific reuse questions," said Kranen. </p>

<p>One thing is for sure. Although the IEEE has resurrected the QIP standard - a spreadsheet meant to demonstrate the approach a vendor took to guarantee quality - hardly anyone in the business still takes it seriously. You can expect more automation to help with IP integration, but a usable quality standard remains elusive.</p>]]>
    </content>
</entry>

<entry>
    <title>Getting ready for the first-quarter rush</title>
    <link rel="alternate" type="text/html" href="http://blog.shrinkingviolence.com/2009/12/getting-ready-for-the-first-qu.html" />
    <id>tag:blog.shrinkingviolence.com,2009://4.533</id>

    <published>2009-12-10T09:28:15Z</published>
    <updated>2009-12-10T10:37:53Z</updated>

    <summary>David Srodzinski, CEO and founder of Scottish fabless semiconductor house Elonics, is preparing for a busy first quarter. Not because, after a devastating slump, the recovery in the chip business got underway halfway through 2009 but because Q1 is the...</summary>
    <author>
        <name>Chris Edwards</name>
        <uri>http://www.chrised.com</uri>
    </author>
    
        <category term="Chipmaking" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Design" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Economics" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Fabless" scheme="http://www.sixapart.com/ns/types#category" />
    
        <category term="Supply &amp; Demand" scheme="http://www.sixapart.com/ns/types#category" />
    
    
    <content type="html" xml:lang="en" xml:base="http://blog.shrinkingviolence.com/">
        <![CDATA[<p><img src="http://blog.shrinkingviolence.com/images/davidsrodzinski.jpg" alt="David Srodzinski" border="0" width="250" height="375" align="left" />David Srodzinski, CEO and founder of Scottish fabless semiconductor house Elonics, is preparing for a busy first quarter. Not because, after a devastating slump, the recovery in the chip business got underway halfway through 2009 but because Q1 is the coming-out season for new silicon. If you are not ready to get chips in front of potential buyers by the end of March, you can pretty much kiss goodbye to business in the second half of the year.</p>

<p>It&rsquo;s a testament to the rise of consumer electronics as a proportion of the overall semiconductor business that the market is now so seasonal. &ldquo;Q1 is the decision time for companies developing new products,&rdquo; Srodzinski explained. &ldquo;That is when they are going to be looking at new components.&rdquo;</p>

<p>Making the selection in Q1 gives the companies approximately six months to get a new system into the market &#8211; in time for Christmas and the Chinese New Year in the following Q1. &ldquo;Christmas drives the cyclical nature of the industry,&rdquo; he said. &ldquo;Miss the Q1 slot and you miss the market for that product completely. After that, they will be concentrating on the actual design. You are in with a small chance during Q2 but you won&rsquo;t get into production with anyone in Q3.&rdquo; </p>

<p>&ldquo;We are focused on RF semiconductors, initially on the broadcast TV and radio space. We are concentrating very much on high-end RF,&rdquo; said Srodzinski. </p>

<p>Formed in 2003, the company is aiming for the time when radios go soft: using signal processing to let the same receiver module deal with practically any frequency, possibly as far as 10GHz. &ldquo;We believe that every radio will be made configurable. And we believe that the receiver can be pushed all the way up there,&rdquo; he added. &ldquo;But that&rsquo;s a big challenge for a start-up to take on. We needed to focus the company as we go to a higher revenue stage. So, we are initially focused on the TV tuner market.&rdquo;<br />
</p>]]>
        <![CDATA[<p>The TV market happens to be a good target as brown-goods makers want to be able to ship the same product anywhere in the world. Right now, they have to use different tuners even for individual countries within the EU because all the TV systems use different parts of the spectrum &#8211; to avoid the national networks from interfering with each other across borders.</p>

<p>&ldquo;The market is interesting for us because it is undergoing a transition. If you open up a TV, there is always a tuner pack.&rdquo; Srodzinski used his slightly battered aluminium business-card holder to demonstrate the difference Elonics claims to make. &ldquo;This is about the same size as a tuner module.&rdquo; </p>

<p>&ldquo;It takes up a lot of space, consumes a lot of power and the performance is variable,&rdquo; said Srodzinski. &ldquo;It consumes something like 3 to 5W and is relatively inflexible. One for the UK is different to a German or a French one. And that is just in Europe.&rdquo;</p>

<p>Size is not the only issue for designers who want to put TV receivers into mobile products. They consume a fairly high proportion of the TV&rsquo;s overall power budget. &ldquo;When I started as an engineer, I worked for Sony and their TVs were 400W units. Today, TVs can go down to 80W. A lot of that is the flat-panel display but each canned tuner takes up around 5W. And, in a modern TV, there are as many as three: one for when you watching, one for recording and one for picture-in-picture.</p>

<p>&ldquo;Today, TV is going into applications such as laptop PCs, cellphones and PDAs. You can&rsquo;t design products with this size of canned tuner within. And the power consumption is prohibitive,&rdquo; said Srodzinski.</p>

<p>In January, in time for 2009&rsquo;s Q1 season, Elonics launched a tuner for DVB-T and DVB-H receivers that the company claims consumes around 120mW and fits into a 5x5mm package. &ldquo;And we have taken the price down from around $5 for a pack to around $1 for a silicon chip.&rdquo;</p>

<p>Srodzinski said some 20 customers have designed-in the product, primarily into laptops being made in Taiwan. Although the market for TV-ready laptops is small right now, he said he expects this to grow into &ldquo;the tens of percentage points&rdquo;. As well as being smaller, because the part can be programmed after assembly for a particular region, the ODM or PC maker only has to assemble one design of system, cutting down on their inventory. &ldquo;It&rsquo;s a very competitive market but we think we have a very competitive product. Also, the market is changing: the customer base is different, with a growing market for digital TV and purely digital devices. That puts new requirements on what you need from a tuner device.&rdquo;</p>

<p>To get the size down further, he claimed it should be possible &ldquo;to squeeze three channels into a single chip&rdquo;.</p>

<p>Srodzinski said he sees a limited benefit to integration with the back-end components, such as the demodulator. These more digitally oriented devices tend sit better with the applications processor, which will typically be made on the most advanced processes available. NXP Semiconductor has launched a 45nm TV processor and STMicroelectronics has had 65nm-based products on the market for a couple of years. But Elonics favours the RF version of the 130nm CMOS process from IBM Microelectronics &#8211; a higher density process would not allow the architecture to scale much and it is a stable process with accurate models and decent on-chip inductors. </p>

<p>&ldquo;At 45nm, our chip would get more expensive. The wafer cost is three to four or five times higher cost,&rdquo; said Srodzinski, but the RF section would not scale, so the company would not reap the benefit of a smaller die. </p>

<p>The fab choice itself was influenced heavily by design.</p>

<p>&ldquo;Many of the process design kits are optimised for technologies such as WiFi. Our tuning range is from 50MHz to 1.7GHz. So, we needed a toolset and device models that work across that entire RF range: We don&rsquo;t have in our company a process-modelling capability,&rdquo; said Srodzinski. &ldquo;We had to rely on providers for that, and so that was the reason for choosing the design flow.</p>

<p>&ldquo;The fab comes first. You need to ensure that the fab characterises things the way you need them to be characterised.&rdquo;</p>

<p>Having opted for the IBM process, the company decided to base its flow on the Virtuoso layout editor and Specctra simulator from Cadence Design Systems, with Matlab used for high-level modelling and some other tools for design-rule checks and mask making, which is where Mentor Graphics&rsquo; Calibre normally slots in.</p>

<p>To check the early stages of the design, Elonics ran a couple of masks on multiproject wafers through IBM: one in 2006 and another in 2007, with the production mask delivered in 2008. </p>

<p>Although a system-on-chip (SoC) design for TV is unlikely, Srodzinski said some customers have wanted to do system-in-package projects to get the overall board space down. &ldquo;We have a number of programmes on the go. Generally, you can do it if there is a real push on modules, although you have a more expensive package and heat dissipation is very important. So you need to choose whether to go with stacked or side-by-side die. It&rsquo;s an interesting market but one we are pursuing.&rdquo;</p>]]>
    </content>
</entry>

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